Product Name | AMAOE MP:2 Qualcomm PM/MTK power IC PM8450/8350BH/7325/8250/MT6365/6359 reballing stencil |
Item NO. | 2040168 |
Smart device Brand | Android |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | MTK stencil , 6350 , MT stencil , Qualcomm stencil , 6360P , 6360 , 6359 , MT6359 , 7150 , PM7150A , 7150A , 8250 , 7250 , PMX55 , 8450 , Qualcomm power ic stencil , Qualcomm IC stencil , AMAOE MP2 stencil , MP2 , AMAOE power ic stencil , MT power IC stencil , MTK power ic stencil , PM8450 , 8350BH , 8350 , PM7325 , 7325 , PM8250 , MT6365 , 6365 , MT6359VPP , Pm7250 , X55 , PM6350 , PM7250B , 7250B , PM4250 , 4250 , PM8350 , PM8350BH , PM8350C , 8350C , PM6225 , 6225 , 6359VPP , MT6635XP , MT6635 , 6635 , 6635XP , MT6365VMW , 6365VMW , 6360P/MP/RP , 6360MP , 6360RP , PM7325B , 7325B , PM7350C , 7350C , 7350 |
Brand | AMAOE |
Creation Time | 2022-06-10 |
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