Product Name | AMAOE Middle Layer Camera motherboard Reballing Stencil Template For Huawei Honor Magic 3 Pro Magic3Pro Solder Tin Planting Net |
Item NO. | 2056087 |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | Stencil , motherboard , AMAOE , Magic 3 Pro , Huawei Honor Magic 3 Pro , Solder Tin |
Brand | AMAOE |
Creation Time | 2022-07-29 |
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