AMAOE Huawei Mate30Pro middle layer reballing kit 0.15MM 0.1MM position board/ base /4G/5G pcb middle layer steel mesh Item NO.: 1316505

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Product Name	AMAOE Huawei Mate30Pro middle layer reballing kit 0.15MM 0.1MM position board/ base /4G/5G pcb middle layer steel mesh
Item NO.	1316505
Smart device Brand	Android, Huawei
BGA reballing kit	Stencil
Weight	0.58 kg = 1.2787 lb = 20.4589 oz
Category	Phone repair tools > BGA reballing kit
Tag	0.15mm , 0.1mm , 0.10mm , Huawei stencil , 0.15mm stencil , Mate30pro , Mate30 pro , 0.10MM stencil , Huawei middle layer reballing , Huawei Mate30Pro middle layer stencil , Huawei Mate30Pro , Huawei Mate30Pro stencil , Mate30pro stencil , Mate 30pro , mate 30 pro , 0.1 stencil , AMAOE reballing kit
Brand	AMAOE
Creation Time	2020-06-18