Product Name | AMAOE Sony Xperia 5II motherboard middle steel mesh stencil |
Item NO. | 1921473 |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | Stencil , sony stencil , Sony Xperia 5II stencil , Sony Xperia 5II motherboard middle steel mesh , Xperia5II , Xperia5 |
Brand | AMAOE |
Creation Time | 2021-11-09 |
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