| Product Name | AMAOE Sony Xperia 5II motherboard middle steel mesh stencil |
| Item NO. | 1921473 |
| BGA reballing kit | Stencil |
| Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | Stencil , sony stencil , Sony Xperia 5II stencil , Sony Xperia 5II motherboard middle steel mesh , Xperia5II , Xperia5 |
| Brand | AMAOE |
| Creation Time | 2021-11-09 |

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