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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 (WhatsApp)
E-mail:Service@tuolitech.com


AMAOE ASUS ROG6 motherboard middle layer tin planting kit

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AMAOE ASUS ROG6 motherboard middle layer tin planting kit Item NO.: 2164202

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US$ 1.90
Model:
Positioning plate Steel mesh Base BGA Platform full set
Quantity:
Stock ( 39999996 )
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Product Name AMAOE ASUS ROG6 motherboard middle layer tin planting kit
Item NO. 2164202
Smart device Brand Laptop
BGA reballing kit Stencil, Tin planting platform
Weight 1.26 kg = 2.7778 lb = 44.4452 oz
Category Phone repair tools > BGA reballing kit
Tag laptop stencil , ASUS ROG6 stencil , ASUS ROG6 , ROG6 , ASUS stencil , AMAOE ASUS stencil , ASUS middle layer stencil , ROG6 middle layer stencil , laptop middle layer stencil
Brand AMAOE
Creation Time 2022-11-03

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