Product Name | AMAOE MSM8953 CPU reballing stencil 0.12MM steel mesh MSM8953-BO1/AB MSM8953-1AB |
Item NO. | 1318308 |
Smart device Brand | Android, Samsung |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | CPU Stencil , 8953 , MSM stencil , MSM8953 , 0.12mm stencil , 0.12mm , Android CPU stencil , Samsung CPU stencil , MSM , AMAOE CPU stencil , 0.12mm CPU stencil , MSM CPU stencil , AMAOE 0.12MM stencil , MSM8953-BO1/AB , MSM8953-1AB , MSM8953 CPU stencil |
Brand | AMAOE |
Creation Time | 2020-06-22 |
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