AMAOE QU:6 Qualcomm CPU Baseband reballing stencil 0.12MM steel mesh QU6 QSC MDM MSM Item NO.: 1318360

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Product Name	AMAOE QU:6 Qualcomm CPU Baseband reballing stencil 0.12MM steel mesh QU6 QSC MDM MSM
Item NO.	1318360
Smart device Brand	Android, Samsung
BGA reballing kit	Stencil
Weight	0.04 kg = 0.0882 lb = 1.4110 oz
Category	Phone repair tools > BGA reballing kit
Tag	CPU Stencil , MDM , MSM stencil , MSM8909 , Android stencil , 0.12mm stencil , 0.12mm , Android CPU stencil , Samsung CPU stencil , Qualcomm CPU stencil , Samsung stencil , Qualcomm , MSM , AMAOE CPU stencil , baseband stencil , 0.12mm CPU stencil , Qualcomm CPU , AMAOE stencil , Qualcomm stencil , 6260 , MSM8909W , MSM8909W stencil , 8909 , 8909W , QSC , QSC stencil , MDM stencil , QU6 , Qualcomm baseband , Qualcomm baseband stencil , AMAOE baseband stencil , Android baseband stencil , 0.12MM baseband stencil , QSC6270 , QSC1110 , QSC1105 , MDM9600 , MDM6600 , MDM8215 , MSM6260 , MSM6246 , MDM9215M , MSM7227 , MSM7521 , QSC6270 stencil , 6270 , QSC1110 stencil , 1110 , QSC1105 stencil , 1105 , MDM9600 stencil , 9600 , MDM6600 stencil , 6600 , MDM8215 stencil , 8215 , MSM6260 stencil , MDM6246 stencil , 6246 , MDM9215M stencil , MDM9215 , 9215 , MSM7227 stencil , 7227 , MSM7521 stencil , 7521 , 9215M
Brand	AMAOE
Creation Time	2020-06-22