AMAOE Redmi K30Pro motherboard middle layer tin planting kit K3P-012 stencil position plate magnetic base Item NO.: 1316130

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Product Name	AMAOE Redmi K30Pro motherboard middle layer tin planting kit K3P-012 stencil position plate magnetic base
Item NO.	1316130
Smart device Brand	Android, XiaoMi
BGA reballing kit	Stencil, Tin planting platform
Weight	0.55 kg = 1.2125 lb = 19.4007 oz
Category	Phone repair tools > BGA reballing kit
Tag	Base , Mi stencil , Redmi stencil , Xiaomi stencil , 0.12mm stencil , Magnetic base , position plate , middle layer stencil , Redmi K30Pro , Redmi K30Pro stencil , K3P-012 , K3P , positioning plate , K30Pro
Brand	AMAOE
Creation Time	2020-06-18