| Product Name | BST Bga Solder Ball Size For Micro Welding Soldering Ball Diameter 0.2/0.3/0.4/0.5/0.6mm |
| Item NO. | 1238809 |
| BGA reballing kit | Solder balls |
| Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
| Category | Phone repair tools |
| Tag | solder ball , bst , BEST , soldering ball , ball |
| Brand | BST |
| Creation Time | 2020-08-14 |




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