Product Name | Amaoe/Q888 reballing stencil/Qualcomm Snapdragon 888CPU/Upper/Lower/Steel mesh stencil |
Item NO. | 1708908 |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | AMAOE stencil , Qualcomm stencil , Snapdragon stencil |
Brand | AMAOE |
Creation Time | 2021-03-11 |
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