Product Name | 730 Tin Planting Network/SM7150/Qualcomm Snapdragon 730/CPU Steel mesh |
Item NO. | 1708909 |
BGA reballing kit | Stencil |
Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | 730 mesh , SM7 150 , 730 stencil mesh , 730 stencil |
Brand | AMAOE |
Creation Time | 2021-03-11 |
No related record found