| Product Name | 730 Tin Planting Network/SM7150/Qualcomm Snapdragon 730/CPU Steel mesh |
| Item NO. | 1708909 |
| BGA reballing kit | Stencil |
| Weight | 0.04 kg = 0.0882 lb = 1.4110 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | 730 mesh , SM7 150 , 730 stencil mesh , 730 stencil |
| Brand | AMAOE |
| Creation Time | 2021-03-11 |
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