| Product Name | XINZHIZAO L23-CPU tin planting station (supports IP(A8-A17)+Qualcomm+Hisilicon+MediaTek, 35 models in total) |
| Item NO. | 2242168 |
| BGA reballing kit | Stencil |
| Weight | 0.51 kg = 1.1244 lb = 17.9897 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | CPU , MEDIATEK , Qualcomm , planting , Planting Station , Tin planting station , xinzhizao , XZZ , A8-A16 , total , XZZ L23 , L23 , a17 |
| Brand | XinZhiZao |
| Creation Time | 2023-05-10 |










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