MaAnt C1 magnetic tin planting platform CPU BGA chip reballing for A8-A17 Qualcomm Huawei Hisilicone series Item NO.: 2010163

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Product Name	MaAnt C1 magnetic tin planting platform CPU BGA chip reballing for A8-A17 Qualcomm Huawei Hisilicone series
Item NO.	2010163
Smart device Brand	Android, Huawei, iPhone
BGA reballing kit	Stencil, Tin planting platform
Weight	0.3 kg = 0.6614 lb = 10.5822 oz
Category	Phone repair tools > BGA reballing kit
Tag	Stencil , C1 , Platform , reballing stencil , Qualcomm CPU , MaAnt , Ma Ant CPU reballing kit , Ma Ant CPU tin planting platform , CPU tin planting platform , iPhone CPU reballing , A15 reballing , Hisilicone CPU , Huawei CPU
Brand	MaAnt
Creation Time	2022-04-12