Product Name | MaAnt MY-228 BGA Soldering Plux Solder Paste For Mobile Phone Motherboard Chip Repair Solder insulation Glue |
Item NO. | 2333542 |
BGA reballing kit | Solder flux paste |
Weight | 0.061 kg = 0.1345 lb = 2.1517 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | BGA , MaAnt , MY-228 , Soldering Plux |
Brand | MaAnt |
Creation Time | 2023-10-20 |
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