| Product Name | MaAnt MY-228 BGA Soldering Plux Solder Paste For Mobile Phone Motherboard Chip Repair Solder insulation Glue |
| Item NO. | 2333542 |
| BGA reballing kit | Solder flux paste |
| Weight | 0.061 kg = 0.1345 lb = 2.1517 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | BGA , MaAnt , MY-228 , Soldering Plux |
| Brand | MaAnt |
| Creation Time | 2023-10-20 |





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