| Product Name | YCS 50g Solder Paste 138°/150°/183°/199°/215° BGA IC PCB Repair for Mobile Phone Motherboard Ball Planting Tin Welding Tools Set |
| Item NO. | 2602481 |
| Weight | 0.051 kg = 0.1124 lb = 1.7990 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | solder paste , 138° , ycs , 138°/150°/183°/199°/215° , 150° , 183° , 199° , 215° |
| Brand | Others |
| Creation Time | 2025-01-14 |





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