| Product Name | YCS Mobile Phone Repair Universal BGA Hard Disk CPU Magnetic Tin Planting Silicone Mat Motherboard IC Chip BGA Stencil Pad |
| Item NO. | 2627837 |
| Weight | 0.079 kg = 0.1742 lb = 2.7866 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | ycs |
| Brand | YCS |
| Creation Time | 2025-04-25 |






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