| Product Name | YCS 2S CPU Heating Platform Magical Degumming Station For Mobile Phone IC CPU Heating Glue Removal Solder Removal BGA Reball |
| Item NO. | 2634104 |
| Weight | 0.3 kg = 0.6614 lb = 10.5822 oz |
| Category | Phone repair tools > Hardware tools |
| Tag | YCS 2S |
| Brand | YCS |
| Creation Time | 2025-06-05 |





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