| Product Name | XZZ BGA stencil kit for Samsung S21/S22/S23/S24/S25 Ultra motherboard middle layer Precision square hole BGA template |
| Item NO. | 2629310 |
| Weight | 0.25 kg = 0.5512 lb = 8.8185 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | Samsung , XZZ |
| Brand | XinZhiZao |
| Creation Time | 2025-05-06 |
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