| Product Name | Mijing high and low temperature 138/158/183/199℃ solder paste for mobile phone motherboard repair CPU solder paste |
| Item NO. | 2676123 |
| Weight | 0.05 kg = 0.1102 lb = 1.7637 oz |
| Category | Phone repair tools > BGA reballing kit |
| Brand | Mijing |
| Creation Time | 2025-09-29 |
No related record found