| Product Name | YCS BGA Chip Temporary IC Planting Tin Steel Mesh For iPhone Qualcomm HiSilicon MediaTek Samsung CPU Tin Planting Station Set |
| Item NO. | 2659617 |
| Weight | 0.1 kg = 0.2205 lb = 3.5274 oz |
| Category | Phone repair tools > BGA reballing kit |
| Tag | ycs |
| Brand | YCS |
| Creation Time | 2025-07-11 |






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