| Product Name | XZZ Universal IC Planting Tin Pad with C1 Magnetic Base XINZHIZAO High-temperature Resistant Insulation Tin Mat |
| Item NO. | 2670469 |
| Weight | 0.1 kg = 0.2205 lb = 3.5274 oz |
| Category | Phone repair tools > BGA reballing kit |
| Brand | XinZhiZao |
| Creation Time | 2025-09-13 |





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