SP-50 BGA IC solder paste 50g 158 degree special lead solder paste for phone Circuit board repair Item NO.: 1311959

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Product Name	SP-50 BGA IC solder paste 50g 158 degree special lead solder paste for phone Circuit board repair
Item NO.	1311959
Tools and Consumables	Solder paste flux
Weight	0.18 kg = 0.3968 lb = 6.3493 oz
Category	Phone repair tools > BGA reballing kit
Tag	solder paste , solder paste flux , soldering paste , Relife solder paste , BGA IC solder paste , IC solder paste , SP-50 , SP50 , SP 50 , 158 degree solder paste , 50g solder paste , 50g
Brand	RELIFE
Creation Time	2020-06-12