Product Name | SP-50 BGA IC solder paste 50g 158 degree special lead solder paste for phone Circuit board repair |
Item NO. | 1311959 |
Tools and Consumables | Solder paste flux |
Weight | 0.18 kg = 0.3968 lb = 6.3493 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | solder paste , solder paste flux , soldering paste , Relife solder paste , BGA IC solder paste , IC solder paste , SP-50 , SP50 , SP 50 , 158 degree solder paste , 50g solder paste , 50g |
Brand | RELIFE |
Creation Time | 2020-06-12 |
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