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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com


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U10/11 Snapdragon 845/855/865/SM8250 upper cover lower CPU positioning board BGA556 soldering platform

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U10/11 Snapdragon 845/855/865/SM8250 upper cover lower CPU positioning board BGA556 soldering platform Item NO.: 2670504

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US$ 18.92
model:
SM8250-002 U10 Soldering Station [865 Large Size] SM8250-102 U11 Tinning Station [Small Size] U14-SM8150 Soldering Station
Quantity:
Stock ( 29999997 )
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Product Name U10/11 Snapdragon 845/855/865/SM8250 upper cover lower CPU positioning board BGA556 soldering platform
Item NO. 2670504
Weight 0.5 kg = 1.1023 lb = 17.6370 oz
Category Phone repair tools > BGA reballing kit
Brand AMAOE
Creation Time 2025-09-13

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AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com