Product Name | AMAOE U6 CPU reballing stencil position platform 0.12MM steel mesh for MSM8994 MSM8996 down |
Item NO. | 1318857 |
Smart device Brand | Android, Samsung |
BGA reballing kit | Stencil, Tin planting platform |
Weight | 0.3 kg = 0.6614 lb = 10.5822 oz |
Category | Phone repair tools > BGA reballing kit |
Tag | MSM8996 Stencil , MSM stencil , MSM8996 , MSM8994 , Android stencil , 0.12mm stencil , 0.12mm , 8994 , 8996 , Android CPU stencil , Samsung CPU stencil , Samsung stencil , MSM , AMAOE CPU stencil , 0.12mm CPU stencil , 0.12MM steel mesh , U6 , U6 position platform , U6 positioning board , MSM8994 stencil |
Brand | AMAOE |
Creation Time | 2020-06-22 |
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