USD

AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com


All Categories

RELIFE RL-093A/B/C 0.1/0.3/0.5mm Chip Heat Sink Copper Sheet for Mobile Phone GPU CPU IC Efficient Heat Dissipation Copper Pad

Copy and share this link on social network or send it to your friends

Copy

RELIFE RL-093A/B/C 0.1/0.3/0.5mm Chip Heat Sink Copper Sheet for Mobile Phone GPU CPU IC Efficient Heat Dissipation Copper Pad Item NO.: 2581597

Write a Review
US$ 2.66
model:
RL-093A RL-093B RL-093C
Quantity:
Stock ( 29999997 )
Shipping Cost:
Estimate Shipping Cost
Add to Cart
Product Name RELIFE RL-093A/B/C 0.1/0.3/0.5mm Chip Heat Sink Copper Sheet for Mobile Phone GPU CPU IC Efficient Heat Dissipation Copper Pad
Item NO. 2581597
Weight 0.41 kg = 0.9039 lb = 14.4623 oz
Category Phone repair tools > Mainboard repair tools
Tag Relife , RL-093A/B/C , 0.1/0.3/0.5mm , 093 , 093A , 093B , 093C
Brand RELIFE
Creation Time 2024-10-30

No related record found

You May Also Like

Recently Viewed

Privacy Clause
About Us
About Us
Contact Us

AddressCompany:Shenzhen Tuoli Electronic Technology Co.,Ltd.
Address:Floor 6, Building B, Baifuli Industrial Park, Shanghenglang Industrial Zone,
Dalang Street, Longhua District, Shenzhen
Service Hotline:008618899777586 （WhatsApp）
E-mail:Service@tuolitech.com